Multiscale concurrent topology optimization for heat conduction with connectable microstructures
Published in International Journal of Heat and Mass Transfer, 2024
Recommended citation: Zhaoyou Sun, Jin Dai, Yaguang Wang, Yangjun Luo*. Multiscale concurrent topology optimization for heat conduction with connectable microstructures, International Journal of Heat and Mass Transfer, 2024, 235, 126222. DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2024.126222.